Nondestructive Testing & Research

RNDT personnel developed a computed radiographic technique to detect solder voids in a diamond to IC chip interface

RNDT personnel developed a computed radiographic technique to detect solder voids in a diamond to IC chip interface

RNDT personnel developed a computed radiographic technique to detect solder voids in a diamond to IC chip interface.  The technique was exactly what the client wanted and was verified by use of destructive and metallographic testing. Full production has started with the arrival of the first 1000 components.

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